The 25 Semiconductor Exhibition
October 25 ~ 27 / COEX SEOUL
2023 Exhibitor Directory
GANA CO.,LTD
주식회사 가나
Booth No.C229- CEOYOO Tae-Gyu / 유태규
- ADDRESSRm805, Smart Bay, 123 Beolmal-Ro, Dongan-Gu, Anyang-Si , Gyeonggi-Do, 14055 Korea / 경기 안양시 동안구 벌말로 123 (관양동, 평촌스마트베이) 805호
- CONTACTTel. 82-31-398-5110 / Fax. 82-31-398-5109 / URL. www.ganatr.co.kr
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Product Item
Industrial adhesive, UV LED curing machine, 정밀 Die bonder, Flip chip bonder, Wire bonder
산업용 접착제, UV LED 경화기 , 정밀 Die bonder, Flip chip bonder, Wire bonder
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Company profile
Gana Co., Ltd., a company specializing in bonding solutions, supplies One Bonding Solution, including cutting-edge equipment such as precision die bonder, flip chip bonder, and wire bonder, as well as various high-performance adhesives and curing equipment.
㈜가나는 첨단 본딩 솔루션 전문기업으로 정밀 Die bonder, Flip chip bonder,Wire bonder첨단 장비와 다양한 고 기능성 접착제 및 경화 장비 등One Bonding Solution 을 공급하는 회사입니다 -
Online consultation schedule
A Guide to Semiconductor Exhibition Date/Time 10:00 11:00 12:00 13:00 14:00 15:00 16:00 10m 5d 10m 6d 10m 7d
(13524) 182, Pangyoyeok-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, Korea
- Tel : +82-2-570-5229
- Fax : +82-2-570-5269
- E-mail : sedex@ksia.or.kr